4,4'-Bis(2,3-epoxypropoxy)biphenyl (CAS 2461-46-3) is a difunctional epoxy monomer featuring a rigid biphenyl core and two reactive glycidyl ether groups. This structure provides excellent thermal stability, mechanical strength, and chemical resistance, making it an important building block in advanced epoxy resin systems.
Applications
High-performance epoxy resins:
The compound is widely used as a reactive component in epoxy formulations for coatings, adhesives, laminates, and encapsulation materials. Its rigid aromatic backbone improves heat resistance, dimensional stability, and mechanical properties of cured systems.
Electronics and electrical materials:
Due to its low dielectric constant and high thermal stability, it is applied in electronic encapsulants, insulating materials, and printed circuit board (PCB) laminates where reliable performance under thermal and electrical stress is required.
Composite materials:
4,4'-Bis(2,3-epoxypropoxy)biphenyl is used in high-performance fiber-reinforced composites, enhancing stiffness, heat resistance, and durability in aerospace, automotive, and structural applications.
Adhesives and coatings:
Its bifunctional epoxy groups allow efficient cross-linking with curing agents, producing coatings and adhesives with strong adhesion, chemical resistance, and long-term stability.
Supply Information
UCHEM can provide 4,4'-Bis(2,3-epoxypropoxy)biphenyl (CAS 2461-46-3) with consistent quality, stable supply, and scalable production to support both research and industrial requirements.
